In many wetting processes, such as the potting of electronic components and the application of adhesives, the liquid of interest is curing as it fills the gap region. In addition to curing, the surfaces encountered in these processes typically have some roughness, which can give rise to complicated free-surface flows. In this presentation a technique will be described to measure how the dependence of the contact angle with contact line velocity evolves with curing time. The test liquid is injected through a hole in the substrate to create a sessile drop. High contact line velocities are achieved by continuous pumping liquid in to the sessile drop, while low velocities are attained by stopping the flow and allowing the drop to spontaneously spread. A time-dependent non-linear Blake wetting model is proposed to fit the measured response and predict the wetting behavior at different cure times. Results from the wetting of cross-linking liquids on various substrate materials will be presented to demonstrate the effects of cure time, temperature, and surface roughness on the measured wetting behavior.