Before fabrication of the membranes, a coupon study was performed to determine how long a membrane would need to be annealed to provide the necessary FCC structure on the surface. Several coupons of porous stainless steel were prepared by depositing Pd by electroless plating followed by a thin layer of Cu (less than 2 μm), also by electroless plating. The coupons were annealed at various times and temperatures and then analyzed with XRD. It was seen that annealing at 500 oC in H2 for 5 hours gave the necessary Cu phase on the surface of the coupon. A Pd/Cu composite membrane was constructed by first oxidizing a porous metallic support (supplied by Mott, Inc.) at 700 oC for 12 hours to form an intermetallic diffusion barrier between the membrane and the support. Afterwards, Pd was deposited by electroless plating until the membrane was impermeable to He followed by a deposition of Cu also by electroless plating. The membrane had a final thickness of 12.5 μm Pd + 1.5 μm Cu. To ensure an FCC Pd/Cu phase on the surface, the membrane was annealed for 5 hours in H2 at 500 oC in accordance with the results of the coupon studies.
The H2 permeance of the membrane was found to be 10.8 m3/m2*h* bar0.5 at 450 oC and did not decrease even after 120 hours of testing at 450 oC. The activation energy was calculated to be 14.7 kJ/mol and the ideal separation factor (JH2 /JHe at ΔP = 1 bar) at 450 oC was 3300. Testing at 500 oC caused a 20% decrease in the permeance.
From the stability of the permeance at 450 oC and the decrease of the permeance at 500 oC, it can be concluded that the Cu gradient was stable at 450 oC and did not diffuse further into the Pd. However, the decrease in permeance seen at 500 oC showed that the Cu gradient was not stable and that the Cu might have diffused further into the Pd.