37d Interfacial Heat Transfer in Presence of Shear Flow

Rajesh Khare, Department of Chemical Engineering, Texas Tech University, P. O. Box 43121, Lubbock, TX 79409-3121, Pawel Keblinski, Materials Science and Engineering, Rensselaer Polytechnic Institute, 110 8th ST, Troy, NY 12180, and Arun Yethiraj, Department of Chemistry, University of Wisconsin, Madison, WI 53706.

Thermal resistance at the interface between a polymer and a surface can play an important role in applications of materials such as nanocomposites. In this work, we use molecular dynamics simulations to study thermal resistance at a solid-liquid interface in the presence of a simple planar shear flow. Interfacial heat transfer properties of two model liquids – a monoatomic liquid and a polymeric liquid (modeled using bead-spring chains) – are studied when confined to nanoscopically thin films. The confining walls are modeled as FCC lattice surfaces and simulations are carried out at different strengths of the solid-liquid interaction (adsorbing or non-adsorbing walls). For both systems, the interfacial thermal resistance in the presence of shear flow was compared with a corresponding system but without the shear flow. We find that an interfacial slip in the velocity profile leads to an increase in the interfacial thermal resistance by about a factor of two, whereas in the absence of the velocity slip, the thermal resistance is not affected by the shear flow.