Composites

Session 307 - Sensing Applications of Nanocomposites
Nanocomposite materials are increasingly the material of choice in transportation, military and medical applications, offering an excellent balance of properties, including high stiffness to weight ratio, high strength, low permeability, and reduced flammability. Such composites may be engineered simultaneously, however, for smart applications using arrays of switches and sensors in fabrics and films, including electro-optical, biosensor and or drug delivery devices. This session invites papers which survey structure/property relationships or processing techniques for smart nanocomposites designed for sensing or switching. We welcome both theoretical and experimental papers.
Chair:Holly A. Stretz
CoChair:Salma Saddawi, Special, Profess
 Welcoming Remarks
 Effect of Foaming on Fiber Orientation and Electrical Conductivity of Polymer Carbon Fiber Composites in Injection Molding
Ghodratollah Hashemi-Motlagh, Michael R. Thompson, Andrew N. Hrymak
 Negative Normal Stresses in Polymer Nanocomposites
Bani H. Cipriano, Gary T. Cheng, Takashi Kashiwagi, Jack Douglas, Srinivasa R. Raghavan
 Hdpe/Al2o3 Nanocomposites Prepared by Extruding Al2o3 Coated Hdpe Particles
Xinhua Liang, Luis F. Hakim, Joseph A. Spencer, Karen J. Buechler, David M. King, Steven M. George, Alan W. Weimer
 Large-Scale Production of Carbon-Coated Copper Nanoparticles for Sensor Applications
Evagelos K. Athanassiou, Robert N. Grass, Wendelin J. Stark
 Break
 Film Characteristics of Magnetic Nanoparticles Incorporated into Tethered Thermoresponsive N-Isopropylacrylamide Copolymer Hydrogels
Beinn V. O. Muir, Cathrin Corten, Dirk Kuckling, Shan X. Wang, Wolfgang Knoll, Curtis W. Frank
 Responsive Polydiacetylene/Silica Nanocomposite Films with Tunable Mesostructure and Thermochromatism
Huisheng Peng, Yunfeng Lu
 Uv-Vis Properties of Zno / Low Density Polyethylene Nanocomposites
Tong Liu, Linda S. Schadler, Richard W. Siegel
 Responsive Nanocomposites Thorugh Hierarchical Assembly
Huisheng Peng, Jing Tang, Lu Yang, Hank Ashbaugh, Yunfeng Lu
 Concluding Remarks

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