Electronics and Photonics | |||
Session 607 - Plasma Processing I - Co-Sponsored by the American Vacuum Society | |||
Papers are solicited on the subject of low-temperature plasmas widely used in fabrication of integrated circuits, micro/nanoelectromechanical systems, and optoelectronic devices. This session will feature both modeling and experimental papers. Paper submission is encouraged in the areas of, but not limited to, plasma physics, gas phase and surface chemistry, kinetics and transport phenomena, plasma-surface interactions, diagnostics, process control, and other emerging areas of plasma science and engineering (e.g., flexible substrate electronics and photovoltaics, plasma treatment of biocompatible surfaces, environmentally benign plasma processing, and microdischarges). | |||
Chair: | Vincent M. Donnelly | ||
CoChair: | Sang M. Han | ||
607a | Effect of the Number of Pairs of Dielectric Barrier Discharge Reactor on Diesel Particulate Matter Removal and Pressure Drop Chihiro Fushimi, Kazuhiko Madokoro, Shuiliang Yao, Yuichi Fujioka, Koichi Yamada | ||
607b | Inertial Gas Admixtures in Pecvd for Uv Absorbing Thin Films of Titanium Dioxide on Polymers Axel Sonnenfeld, Philipp Rudolf von Rohr | ||
607c | Plasma Treatment of Low Density Polyethylene (Ldpe) Using an Low-Temperature Cascade Arc Torch Mary Gilliam, Andrew Ritts, Qingsong Yu | ||
607d | Diagnostics of Inductive-Coupled Ch2f2/Cf4 Plasma Using Langmuir Probe and Quadruple Mass Spectrometry Ta-Chin Wei, Chi-Hung Liu | ||
607e | Plasma Interface Engineered Coating Systems for Magnesium Alloys Jin Zhang, YenFong Chan, Qingsong Yu |
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